Working under DARPA’s ICECool program, IBM and Georgia Tech replaced water cooling with a liquid dielectric that can run between the chips in a 3-D stack without shorting them out. http://ift.tt/2wmi1jk R. Colin Johnson
Working under DARPA’s ICECool program, IBM and Georgia Tech replaced water cooling with a liquid dielectric that can run between the chips in a 3-D stack without shorting them out. http://ift.tt/2wmi1jk R. Colin Johnson
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